This repository has been archived by the owner on Oct 7, 2020. It is now read-only.
Add WQFN-20-1EP_3x3mm_P0.4mm_EP1.7x1.7mm_ThermalVias #638
Add this suggestion to a batch that can be applied as a single commit.
This suggestion is invalid because no changes were made to the code.
Suggestions cannot be applied while the pull request is closed.
Suggestions cannot be applied while viewing a subset of changes.
Only one suggestion per line can be applied in a batch.
Add this suggestion to a batch that can be applied as a single commit.
Applying suggestions on deleted lines is not supported.
You must change the existing code in this line in order to create a valid suggestion.
Outdated suggestions cannot be applied.
This suggestion has been applied or marked resolved.
Suggestions cannot be applied from pending reviews.
Suggestions cannot be applied on multi-line comments.
Suggestions cannot be applied while the pull request is queued to merge.
Suggestion cannot be applied right now. Please check back later.
As suggested in KiCad/kicad-footprints#2111 I tried to create the footprint, by adding the necessary data into the YAML file.
I couldn't find a documentation of all the available properties, so there are some deviations from the suggested land pattern. There should be five thermal vias, but currently I only could implement four.
The EP should be 1.8x1.8 mm according to the data sheet, but when I check the footprint in the GUI it is only 1.7x1.7 mm. Maybe someone can give me a hint here.